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DOMINUS Coater, OPTIcoat ST30i is a new and innovative spray coating system with a revolutionary nozzle concept. The patent pending micro spray nozzle allows, together with a closed process chamber and process approved exhaust system, uniform coatings over high topography surfaces. |
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The DOMINUS Coater, OPTIcoat ST22i is a new and innovative spray coating system with a revolutionary nozzle concept, equipped with an integrated hotplate. The patent pending micro spray nozzle allows, together with a closed process chamber and process approved exhaust system, uniform coatings over high topography surfaces. |
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The DOMINUS Coater, OPTIcoat ST20i is a new and innovative spray coating system with a revolutionary nozzle concept. The patent pending micro spray nozzle allows, together with a closed process chamber and process approved exhaust system, uniform coatings over high topography surfaces. |
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The maximus 806 is a fully automatic and programmable cassette-to-cassette micro-cluster system. It can be equipped with modules as coater, developer, cleaning, HMDS vapor primer, hotplates and coolplates for wafer sizes from Ø 4” up to Ø 8”. Two robots, one for the I/O handling and one for the process-module handling are able to handle even fragile materials very gently.
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The maximus 804 is a fully automatic and programmable cassette-to-cassette micro-cluster system. It can be equipped with modules as coater, developer, cleaning, HMDS vapor primer, hotplates and coolplates for wafer sizes from Ø 2” up to Ø 8” and substrates from 2”x 2” up to 6”x 6”. |
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maximus 802 is a fully automatic and programmable cassette-to-cassette micro-cluster system. It can be equipped with modules as coater, developer, cleaning, HMDS vapor primer, hotplates and coolplates for wafer sizes from Ø 2” up to Ø 8” and substrates from 2”x 2” up to 6”x 6”. |
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The OPTIspin SB 20 spinner module is a process tool for typical coating applications of wafers and other substrates. |
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The OPTIspin SST 20 Spinner System is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates. It is also possible to perform developing, cleaning or drying applications with this spinner system. |
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The OPTIspin ST 20 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates. It is also possible to perform developing, cleaning or drying applications with this spinner system. |
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OPTIspin ST 22 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the spinner system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates, extended by hard/soft bake processes. It is also possible to perform developing, cleaning or drying applications with this spinner system. |
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The OPTIspin ST 23 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the spinner system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates, extended by hard/soft bake and a HMDS vapor prime process. |
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OPTIspin SB 30 spinner module is a process tool for typical coating applications of wafers and other substrates. |
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OPTIspin ST 30 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the system provides excellent coating uniformity and repeatability for up to 300mm wafers or up to 9”x 9” substrates. It is also possible to perform developing, cleaning or drying applications with this spinner system. |
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The OPTIcoat SB 20 Coating System is a coating spinner with a process optimized covered chuck technology for 2” to 8” wafers or up to 6”x 6” substrates. The new design of the three piece process bowl and the covered chuck technology provides excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates. |
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The OPTIcoat SST 20 Coating System is a coating spinner with a process optimized covered chuck technology for 2” to 8” wafers or up to 6”x 6” substrates. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates. |
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The OPTIcoat ST 20 Coating System is a coating spinner with a process optimized covered chuck technology for 2” to 8” wafers or up to 6”x 6” substrates. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates. |
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The OPTIcoat ST 22 Coating System is a process tool for coating applications with a process optimized covered chuck technology and integrated hotplate for wafers from 2” to 8” or substrates up to 6”x 6”, extended by hard/soft bake processes. The new designed three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability especially for thick resist layers, high topography or square substrates. |
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The OPTIcoat ST 23 Coating System is a process tool for coating applications with a process optimized covered chuck technology and integrated hotplate for wafers from 2” to 8” or substrates up to 6”x 6”, extended by hard/soft bake and a HMDS vapor prime process. The new designed three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability especially for thick resist layers, high topography or square substrates. |
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The OPTIcoat SB 30 Coating Module is a coating spinner with a process optimized covered chuck technology for wafers up to 300 mm or substrates up to 9”x 9”. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates. |
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SPIN COATING SYSTEM
The OPTIcoat ST 30 Coating System is a coating spinner with a process optimized covered chuck technology for wafers up to 300 mm or substrates up to 9”x 9”. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates. |
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SPIN COATING + HOTPLATE SYSTEM
The OPTIcoat ST 32 Coating System is a coating spinner with a process optimized covered chuck technology and integrated hotplate for wafers up to 300mm or substrates up to 9”x 9”, extended by hard/soft bake processes. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates.
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The OPTIcoat ST 60 Coating System is a coating spinner with a process optimized covered chuck technology for substrates up to 16” x 16” or Ø 560mm. The new design of the three piece process bowl and the covered chuck technology provide excellent coating uniformity and repeatability, especially for thick resist layers, high topography or square substrates. |
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The OPTIcoat ST 75 Coating System is a coating spinner with a process optimized covered chuck technology ® for substrates up to 20” x 20” or Ø 750mm. The design of the three piece process bowl and the covered chuck technology ® provide excellent coating uniformity and repeatability, especially square sub-strates and special applications. |
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