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The DOMINUS Coater, OPTIcoat ST22i is a new and innovative spray coating system with a revolutionary nozzle concept, equipped with an integrated hotplate. The patent pending micro spray nozzle allows, together with a closed process chamber and process approved exhaust system, uniform coatings over high topography surfaces. |
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The maximus 806 is a fully automatic and programmable cassette-to-cassette micro-cluster system. It can be equipped with modules as coater, developer, cleaning, HMDS vapor primer, hotplates and coolplates for wafer sizes from Ø 4” up to Ø 8”. Two robots, one for the I/O handling and one for the process-module handling are able to handle even fragile materials very gently.
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The maximus 804 is a fully automatic and programmable cassette-to-cassette micro-cluster system. It can be equipped with modules as coater, developer, cleaning, HMDS vapor primer, hotplates and coolplates for wafer sizes from Ø 2” up to Ø 8” and substrates from 2”x 2” up to 6”x 6”. |
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maximus 802 is a fully automatic and programmable cassette-to-cassette micro-cluster system. It can be equipped with modules as coater, developer, cleaning, HMDS vapor primer, hotplates and coolplates for wafer sizes from Ø 2” up to Ø 8” and substrates from 2”x 2” up to 6”x 6”. |
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OPTIspin ST 22 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the spinner system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates, extended by hard/soft bake processes. It is also possible to perform developing, cleaning or drying applications with this spinner system. |
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The OPTIspin ST 23 spinner system is a new process tool for typical coating applications of wafers and other substrates. The new designed three piece process bowl of the spinner system provides excellent coating uniformity and repeatability for 2” to 8” wafers or up to 6”x 6” substrates, extended by hard/soft bake and a HMDS vapor prime process. |
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OPTIhot HB 20 is a new designed hotplate module for typical lithography baking applications like soft and hard bake or similar processes up to 300°C. The hotplate is suitable for wafers up to 8” and substrates up to 6”x 6”. |
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The OPTIhot HB 20+ is a new designed Hotplate module for typical lithography baking applications like Soft and Hard bake or similar processes up to 300°C. The hotplate is suitable for wafers up to 8” and substrates up to 6”x 6”. |
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The OPTIhot VB 20 is a new designed HMDS hotplate module for typical HMDS wafer priming and dehydration bake lithography applications. The tool combines vapour priming and vacuum dehydration baking processes to optimize the substrate wetting and adhesion of photo resist on the wafer surface. |
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The OPTIhot HT 60 is a new designed hotplate system for typical lithography baking applications like soft and hard bake or similar processes up to 200°C. The hotplate is suitable for substrates up to 16” x 16” or Ø 22” (Ø 560mm). |
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The OPTIhot SHT 20 is a new designed compact stand alone Hotplate System for typical lithography baking applications like soft and hard bake or similar processes up to 300°C. The hotplate is suitable for wafers up to 8” and substrates up to 6”x 6”. |
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The OPTIhot SHT 20+ is a new designed compact stand alone Hotplate System for typical lithography baking applications like Soft and Hard bake or similar processes up to 300°C. The hotplate is suitable for wafers up to 8” and substrates up to 6”x 6”. |
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The OPTIhot SHT 30 is a new designed compact stand alone Hotplate System for typical lithography baking applications like soft and hard bake or similar processes up to 300°C. The hotplate is suitable for wafers up to 300mm and substrates up to 9”x 9”. |
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The OPTIhot SVT 20 is a new designed HMDS Hotplate System for typical HMDS wafer priming and dehydration bake lithography applications. The tool combines vapour priming and vacuum dehydration baking processes to optimize the substrate wetting and adhesion of photo resist on the wafer surface. |
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